According to Union Minister Ashwini Vaishnaw, the government has received applications for electronics manufacturing schemes of Rs 70, with most applicants being small and medium-sized enterprises. |Picture source: ANI
According to Union Minister Ashwini Vaishnaw, the government has received applications for an electronics manufacturing scheme of Rs 70, with most applicants being small and medium-sized enterprises.
“The electronic component manufacturing program has received a huge response. A total of 70 applications were received in 15 days,” Mr Vaishnaw said. pti.
The minister did not name it. But, sources earlier said Tata Electronics, Dickson Technology and Foxconn were the biggest players showing interest.
Mr Vaishnaw said that while some of the large players have applied, small and medium players have attracted great interest.
“80% of the applications come from small and medium-sized enterprises,” the minister said.
The government began accepting applications for the Electronic Component Manufacturing Scheme (ECMS) of Rs 228,050 crore on May 1.
The solution is designed to address the problem of insufficient demand supply in the electronic components segment.
Demand supply deficit
The Electronics Industry Association, the oldest industry body in the country’s electronics industry, estimates that the supply of demand in the electronics sector will increase to US$248 billion (about Rs2.1 million) by 2030, and by 2030, this will require in the estimated US$50 billion, which will require any measurement in Electronics and Informational, and it will obtain any quantity of products in any range, and it will obtain any range of products in any range. government.
The main part of the plan is Rs 21,093 crore, which is dedicated to sub-assemblies such as camera modules, multi-layer printed circuit boards (PCBs), flexible PCBs and passive components that are fixed to the PCB. A total of Rs 1,712 crore is used to manufacture sub-assemblies for electronic manufacturing and parts in capital goods.
The solution classifies display modules and camera module subassemblies into Class A, while Class B products include bare metal components such as non-surface mount devices, multi-layer printed circuit boards, lithium-ion units for digital applications, IT hardware products and related equipment.
publishing – May 18, 2025, 10:58 pm IST
